PCB Capabilities
Technical index | Mass Batch | Small batch | Sample | |||
Base Material | FR4 | Normal Tg | Shengyi S1141、KB6160、Huazhen H140(not suitable for lead free process ) | |||
Middle Tg | For HDI、multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662; | |||||
High Tg | For thick copper、high layer:SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752; | |||||
Halogen Free | Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg: SY S1165 | |||||
High CTI | CTI≥600 SY S1600、Huazheng H1600HF、H1600A; | |||||
High Frequency | Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 | |||||
High Speed | SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380 | |||||
Flex Material | Base | Glue-free:Dupont AK XingyangW-type, Panosonic RF-775; | ||||
Coverlay | SY SF305C、Xingyang Q-type | |||||
Special PP | No flow PP:VT-447LF,Taiguang 370BL Arlon 49N | |||||
Metal Base | Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase | |||||
Special | High heat resistance rigidity PI:Tenghui VT-901、Arlon 85N,SY S260(Tg250) | |||||
Layers | FR4 | 24 | 36 | 64 | ||
Rigid&Flex /(Flex) | 16(12) | 20(12) | 24(16) | |||
High Frequency Mixed Lamination | 12 | 18 | 24 | |||
100% PTFE | 4 | 12 | 18 | |||
HDI | 2 steps | 3 steps | 4 steps | |||
Technical Index | Mass Batch | Small Batch | Sample | |||
Delivery Size | Max(mm) | 460*560 | 460*560 | 550*900 | ||
Min(mm) | 20*20 | 10*10 | 5*10 | |||
Width / Gap | Inner(mil) | 0.5OZ base copper:3/3 | ||||
Outer(mil) | 1/3OZ base copper:3/3 | |||||
Line Width Tolerance | >5.0 mil | ±20% | ±20% | ±1.0mil | ||
≤5.0 mil | ±1.0mil | ±1.0mil | ±1.0mil | |||
Copper Thickness | Inner layer(OZ) | 4 | 6 | 12 | ||
Out layer(OZ) | 4 | 6 | 15 | |||
Drilling | Min laser (mm) | 0.1 | 0.1 | 0.1 | ||
Min CNC(mm) | 0.2 | 0.15 | 0.15 | |||
Max CNC drill bit(mm) | 6.5 | 6.5 | 6.5 | |||
Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |||
PTH Hole (mm) | Normal | ±0.1 | ±0.075 | ±0.075 | ||
Pressing Hole | ±0.05 | ±0.05 | ±0.05 | |||
Hole Angle (conical) | Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900; | |||||
Precision of Depth-control Drilling(mm) | ±0.10 | ±0.075 | ±0.05 | |||
Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |||
Minimum via hole spacing (different network, military, medical, automobile )mm | 0.50 | 0.45 | 0.40 | |||
Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |||
Technical index | Mass batch | Small batch | sample | |||
Drilling | The minimum hole wall spacing of the over hole (the same network mm) | 0.20 | 0.2 | 0.15 | ||
Minimum hole wall spacing (mm) for device holes | 0.80 | 0.70 | 0.70 | |||
The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L:0.15 | |||
The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |||
Welding Ring | Via hole | 4(HDI 3mil) | 3.5(HDI 3mil) | 3 | ||
Component hole | 8 | 6 | 6 | |||
Solder Dam (mil) | (solder mask) | 5 | 4 | 4 | ||
(hybrid) | 6 | 5 | 5 | |||
Final Board Thickness | >1.0 mm | ±10% | ±8% | ±8% | ||
≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |||
Board thickness(mm) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | |||
Board thickness/drill bit | 10:1 | 12:1 | 13:1 | |||
Via hole(drill bit)plug hole(plug solder ) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | |||
Blind buried hole, hole inside pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | |||
Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% | |||
Impedance Control | ≥5.0mil | ±10% | ±10% | ±8% | ||
<5.0mil | ±10% | ±10% | ±10% | |||
CNC | contour tolerance(mm) | ±0.15 | ±0.10 | ±0.10 | ||
V-CUT Tolerance of residual thickness(mm) | ±0.15 | ±0.10 | ±0.10 | |||
Routing slot(mm) | ±0.15 | ±0.10 | ±0.10 | |||
Precision of controlled deep milling(mm) | ±0.15 | ±0.10 | ±0.10 | |||
Technical index | Mass batch | Small batch | sample | |||
Contour | Bevel edge | 20~60 degree;±5degree | ||||
Surface Treatments | Immersion gold | Ni thickness | 118-236 | 118-236 | 118-236 | |
Max gold (uinch) | 3 | 3 | 6 | |||
Hard gold(Au thick) | Gold finger | 15 | 30 | 60 | ||
NiPdAu | NI | 118-236 | ||||
PA | 2-5 | |||||
Au | 1-5 | |||||
Graph electric gold | NI | 120-400 | ||||
AU | 1-3 | |||||
Immersion tin | Tin | 0.8-1.2 | ||||
Immersion Ag | Ag | 6-10 | ||||
OSP | thick | 0.2-0.5 | ||||
HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||||
thickness | 0.6≤H≤3.0 | |||||
Board thickness vs hole diameter | Press hole≤3:1 | |||||
Tin(um) | 2.0-40.0 | |||||
Rigid & Flex | Maximum dielectric thickness of flex | Glue –free 25um | Glue-free 75um | Glue-free75um | ||
Flex part width(mm) | ≥10 | ≥5 | ≥2 | |||
Max delivery size (mm) | 200×400 | 200×500 | 400 ×550 | |||
distance of via hole to edge of Rigid&flex(mm) | ≥1.2 | ≥1.0 | ≥0.8 | |||
(mm)distance of components hole to the edge of R&F | ≥1.5 | ≥1.2 | ≥1.0 | |||
Technical index | Mass batch | Small batch | sample | |||
Rigid & Flex | Structure | The outer layer structure of the flex part, the PI reinforcement structure and the separation structure | Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film | |||
Special Tech | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
EMS Capabilities
Item | Lot Size | ||||
Normal | Special | Remark | |||
PCB(used for SMT)spec | (L*W) | Min | L≥50mm | L<50mm | Includes the Process Edge |
Max | L≤460mm | L>460mm | |||
(T) | Min thickness | 0.5mm | T<0.5mm | ||
Max thickness | 4.5mm | T>4.5mm | |||
SMT components spec | outline dimension | Min size | 0201 | 01005 | / |
Max size | 200mm*125mm | 200mm*125mm<SMD | / | ||
component thickness | T≤6.5mm | 6.5mm<T≤15mm | / | ||
QFP、SOP、SOJ(multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | / | |
CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | / |
Item | Prototype Manufacturer | ||||
Normal | Special | Remark | |||
SMT PCB SPEC | (L*W) | Min size | L≥50mm | L<50mm | Includes the Process Edge |
Max size | L≤450mm | L:800-450mm | |||
(T) | Minimum thickness | 0.8mm | T<0.8mm | ||
Maximum Thickness | 2mm | T>2mm | |||
DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L<50mm | |
Max Size | L≤500mm | L≥500mm | |||
(T) | Minimum Thickness | 0.8mm | T<0.8mm | ||
Maximum Thickness | 2mm | T>2mm |
CAD Capabilities
Item | Parameter | ||
Max Design Layer | 48L | ||
Min Trace Width / Space | Inner Layer | 2.5mil | |
Out Layer | 2.8mil | ||
Min Hole Diameter | CNC | 6mil | |
Laser | 4mil | ||
Max PIN Quantity in a Board | 50000PIN | ||
Max BGA Quantity in a Board | 30PCS | ||
Min Space Between two BGA | 0.35mm | ||
Max Signal | 40Gbps | ||
Product Type | Data Communication Products | ATCA、AMC、CPCI、PCIE | |
Optical Network Products | SDH/DWDM、LMDS、GSM/GPRS | ||
Multimedia Products | Video Telephone, Conference TV, Monitoring Equipment, etc. | ||
Computer Product | MB、NB、SERVER main board | ||
Aerospace Products | Satellite Navigation, Flight Control System, Communication Positioning System | ||
Industry Control Product | ARM、DSP、X86 | ||
Consumer Product | Smart Home Appliances, Smart Phones, Smart Clothes, etc. |